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Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
(UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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