Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Sohn, YC
Showing results 12 to 18 of 18
| Overview of the Electronic Packaging Technologies in Korea Yu, Jin; Sohn, YC; Kim, JI, ICEP 2005, pp.4 - 8, 2005 |
| Spalling behaviors of intel-metallic compounds during the etting reaction of Sn(3.5Ag) on electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, Proceedings of 2004 International IEEE Conference on Asian Green Electronics (AGEC), pp.177 - 181, 2004-01-05 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01 |
| Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P Sohn, YC; Yu, Jin; Kang, SK; Choi, WK; Shih, DY, JOURNAL OF MATERIALS RESEARCH, v.18, no.1, pp.4 - 7, 2003-01 |
| 무전해 Ni-P막의 P함량 변화에 따른 Sn과의 반응 메커니즘 연구 유진; Sohn, YC; Kang, SK; Shih, DY; Choi, WK, 한국마이크로전자 및 패키징학회지, pp.88 - 93, 2003 |
| 화학증착법으로 제조한 다이아몬드막의 고유응력에 대한 탄성/크리프 해석(An Elastic/Plastic Analysis of The Intrinsic Stresses in CVD Diamond Films) 유진; Kim, JK; Sohn, YC, Conf. Mech. Beh. Maters., pp.301 - 310, 2000 |
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