Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject RELIABILITY
Showing results 27 to 39 of 39
| Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11 |
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs) Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04 |
| Numerical Analysis of 3D CSP MEMS Under Thermal Cycle-Impact Coupled Multiphysics Loads Zhang, Shuye; Sun, Mingjia; Yang, Jianqun; Li, Xingji; He, Peng; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.1, pp.26 - 33, 2023-01 |
| Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
| Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging Yim, Myung Jin; Li, Yi; Moon, Kyoung-sik; Paik, Kyung-Wook; Wong, C. P., JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.22, no.14, pp.1593 - 1630, 2008 |
| Secondary IMC formation induced by Kirkendall voiding in Cu/Sn-3.5Ag solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.25, no.9, pp.1854 - 1858, 2010-09 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02 |
| Studies on solder bumps coining processes and reliability of assembled flip chip = 솔더 범프 코이닝 공정 및 플립칩 접속 후 신뢰성에 관한 연구link Nah, Jae-Woong; 나재웅; et al, 한국과학기술원, 2004 |
| Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs) Suk, Kyoung-Lim; Choo, Kyo-Sung; Kim, Sung-Jin; Kim, Jong-Soo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1182 - 1188, 2012-06 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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