DSpace at KOASAS
Browsing DSpace

Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject intermetallic compound

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 8 to 13 of 13

8
Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint

Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11

9
Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate

Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06

10
Sn-3.5Ag 솔더와 Zn 표면층의 반응을 통한 솔더 계면현상과 충격 신뢰성에 관한 연구

지영근; 유진, 마이크로전자 및 패키징학회지, v.15, no.4, pp.87 - 92, 2008-12

11
Sn-Ag-Cu계 솔더 합금과 Cu, Ni 기판의 계면 현상 및 계면 생성물의 성장 거동에 관한 연구 = Studies on interfacial reaction and microstructural evolution of joint interface between Sn-Ag-Cu solder alloy and Cu, Ni substratelink

김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2005

12
The effect of microstructures on creep behavior of Ti-48Al-2W intermetallic compounds

Kim, HY; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.329 , no.SI, pp.788 - 794, 2002-06

13
액상 Au-Sn 솔더와 Ni 기판의 계면현상에 대한 고찰

김종훈; 정상원; 이혁모; 김성수, Journal of the Microelectronics and Packaging Society, v.11, no.3, pp.47 - 53, 2004-09

Discover

rss_1.0 rss_2.0 atom_1.0