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Showing results 9 to 16 of 16

9
Highly reliable hybrid nano-stratified moisture barrier for encapsulating flexible OLEDs

Jeong, Eun Gyo; Han, Yun Cheol; Im, Hyeon-Gyun; Bae, Byeong-Soo; Choi, Kyung Cheol, ORGANIC ELECTRONICS, v.33, pp.150 - 155, 2016-06

10
LCD 패키징용 이방성전도필름의 전기전도기구와 신뢰성에 관한 연구 = A study on the electrical conduction mechanism and reliability of anisotropically conductive films(ACFs) for LCD packaging applicationslink

임명진; Yim, Myung-Jin; et al, 한국과학기술원, 1997

11
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11

12
Material properties of anisotropic conductive adhesives (ACAs) and flip chip assembly reliability for chip-on-board (COB) applications = Chip-on-Board (COB) 패키지를 위한 이방성 전도성 접착제의 물성 및 플립칩 신뢰성에 관한 연구link

Jang, Kyung-Woon; 장경운; et al, 한국과학기술원, 2008

13
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

14
Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link

Son, Ho-Young; 손호영; et al, 한국과학기술원, 2008

15
The preparation of anisotropic conductive paste and its application in FOB interconnection

Cai, Xionghui; Zhai, Aixia; Zhou, Chenglong; Paik, Kyung-Wook, MICROELECTRONICS INTERNATIONAL, v.40, no.2, pp.166 - 171, 2023-03

16
나노인덴터를 활용한 RF MEMS 스위치의 신뢰성 평가 연구 = Characterization of contact reliability in RF MEMS switch using nano-indenterlink

김동석; Kim, Dong-Seok; et al, 한국과학기술원, 2010

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