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Showing results 4 to 7 of 7

4
Galvanic corrosion behaviors of Cu connected to Au on a printed circuit board in ammonia solution

Oh, Se-Kwon; Kim, Youngjun; Jung, Ki Min; Park, Miseok; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.24, no.1, pp.67 - 72, 2018-01

5
Galvanic Corrosion of Cu Coupled to Au on a Print Circuit Board; Effects of Pretreatment Solution and Etchant Concentration in Organic Solderability Preservatives Soft Etching Solution

Oh, Se-Kwon; Kim, YoungJun; Shon, MinYoung; Kwon, Hyuk-Sang, METALS AND MATERIALS INTERNATIONAL, v.22, no.5, pp.781 - 788, 2016-09

6
Segregation engineering enables nanoscale martensite to austenite phase transformation at grain boundaries: A pathway to ductile martensite

Raabe, D.; Sandloebes, S.; Millan, J.; Ponge, D.; Assadi, H.; Herbig, M.; Choi, Pyuck-Pa, ACTA MATERIALIA, v.61, no.16, pp.6132 - 6152, 2013-09

7
Segregation of boron at prior austenite grain boundaries in a quenched martensitic steel studied by atom probe tomography

Li, Y. J.; Ponge, D.; Choi, Pyuck-Pa; Raabe, D., SCRIPTA MATERIALIA, v.96, pp.13 - 16, 2015-02

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