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Showing results 11 to 17 of 17

11
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)

Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01

12
Moisture induced interface weakening in ACF package

Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12

13
Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)

Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04

14
Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs

Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008

15
Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability

Kim, Hyoung-Joon; Chung, Chang-Kyu; Kwon, Yong-Min; Yim, Myung-Jin; Hong, Soon-Min; Jang, Se-Young; Moon, Young-Joon; et al, JOURNAL OF ELECTRONIC MATERIALS, v.36, pp.56 - 64, 2007-01

16
Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications

Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10

17
Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs)

Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01

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