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Effects of Thermo-compression Bonding Parameters on Joint Formation of Micro-bumps in Non-conductive Film (NCF) Shin, Ji-Won; Kim, Young Soon; Lee, Hyoung Gi; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
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