Showing results 1 to 3 of 3
Effect of electromigration on mechanical shear behavior of flip chip solder joints Nah, JW; Ren, F; Paik, Kyung-Wook; Tu, KN, JOURNAL OF MATERIALS RESEARCH, v.21, pp.698 - 702, 2006-03 |
Effects of current density on electromigration-induced failure in flip chip composite solder joints at room temperature Nah, JW; Suh, JO; Paik, Kyung-Wook; Tu, KN, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.50 - 53, 2005-03-16 |
Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Nah, JW; Paik, Kyung-Wook; Suh, JO; Tu, KN, JOURNAL OF APPLIED PHYSICS, v.94, pp.7560 - 7566, 2003-12 |
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