Showing results 1 to 12 of 12
Comparition of Sn-2.8Ag-20In and Sn-10Bi-10In Solders for Intermedate Step Soldering Lee, Hyuck Mo; Seo, SK; Choi, WK, 135th TMS Annual Meeting, 2006-03-14 |
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders Kang, SK; Cho, MG; Shih, DY; Seo, SK; Lee, Hyuck Mo, 2008 58th Electronic Components and Technology Conference, ECTC, pp.478 - 484, 2008-05-27 |
Effect of Ag on Growth Behavior of Cu6Sn5 Formed between Molten Cho, MG; Seo, SK; Lee, Hyuck Mo, 2011 TMS annual meeting (140th), 2011-03-02 |
Effect of Ag on ripening growth of Cu6Sn5 grains formed between molten Sn-xAg-0.5Cu solders and Cu Cho, MG; Park, YS; Seo, SK; Paik, KW; Lee, Hyuck Mo, 60th Electronic Components and Technology Conference, ECTC 2010, pp.170 - 175, 123, 2010-06-01 |
Enhancement of Heteroheneous Nucleation of β-Sn Phases in Sn-Rich Solders by Adding Minor Alloying Elements with Hexagonal Closed Packed Structures Cho, MG; Kim, HY; Seo, SK; Lee, Hyuck Mo, 2010 TMS annual meeting (139th), 2010-02-16 |
Experimental Investigation of Phase Equilibria in the Sn-Ni-Zn System Chang, JW; Seo, SK; Lee, Hyuck Mo, proceeding of 39th CALPHAD, 2010-05-24 |
Experimental Investigation of Phase Equilibria in the Sn-Ni-Zn System Chang, JW; Seo, SK; Lee HyuckMo, 39th CALPHAD, 2010-05-26 |
Hermetic packaging of micro scanner for laser display applications Choi, WK; Cho, MG; Seo, SK; Lee, Hyuck Mo; Jeong, BG; Lee, HS; Ko, YC; et al, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, pp.751 - 756, 2005-07-17 |
Microstructures and Crystal Orientation of β-Sn for Sn-Ag and Sn-Cu solder Joints under Electromigration Seo, SK; Kang, SK; Cho, MG; Lee, Hyuck Mo, 2010 TMS annual meeting (139th), 2010-02-15 |
Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders Seo, SK; Cho, MG; Kang, SK; Chang, J; Lee, Hyuck Mo, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.84 - 89, 2011-05-31 |
Phase Equilibria in the Sn-Ni-Zn Ternary System Chang, JW; Seo, SK; Lee, Hyuck Mo, 2010 TMS annual meeting (139th), 2010-02-16 |
Sn-Ni-Zn : A Key System for High-temperature Soldering Chang, JW; Seo, SK; Lee, Hyuck Mo, Korean Journal of Metals and Materials, 2010-04-23 |
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