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Interfacial reaction between 42Sn-58Bi solder and electroless Ni-P/immersion Au under bump metallurgy during aging Cho, MG; Paik, Kyung-Wook; Lee, HyuckMo; Booh, SW; Kim, TG, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.1, pp.35 - 40, 2006-01 |
Microstructural evolution of joint interface between eutectic 80Au-20Sn solder and UBM Kim, SS; Kim, JH; Booh, SW; Kim, TG; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.46, no.11, pp.2400 - 2405, 2005-11 |
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