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Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development Lee, Jung-Sub; Chu, Kun-Mo; Patzelt, Rainer; Manessis, Dionysios; Ostmann, Andreas; Jeon, DukYoung, MICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583, 2008-07 |
Highly Accelerated Self-Assembly and Fibrillation of Prion Peptides on Solid Surfaces Ku, Sook Hee; Park, Chan Beum, LANGMUIR, v.24, no.24, pp.13822 - 13827, 2008-12 |
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