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A Study on Double Layer Non-Conductive Films (D-NCFs) for 3D-Through Silicon Via (TSV) Interconnection using Cu-pillar/SnAg Micro-Bump = 3D-Through Silicon Via (TSV) 미세피치 Cu-pillar/SnAg Micro-Bump 접속용 이중층 비전도 접속 필름 연구link Se Yong, Lee; Paik, Kyoung Wook; et al, 한국과학기술원, 2018 |
Effect of deposition temperature on the crystallization mechanism of amorphous silicon films on glass Lee, JN; Lee, BJ; Moon, DG; Ahn, Byung Tae, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.36, no.11, pp.6862 - 6866, 1997-11 |
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06 |
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08 |
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