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Improved TiN film as a diffusion barrier between copper and silicon Rha, SK; Lee, WJ; Lee, SY; Hwang, YS; Lee, YJ; Kim, DI; Kim, DW; et al, THIN SOLID FILMS, v.320, no.1, pp.134 - 140, 1998-05 |
Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun, SS, JOURNAL OF MATERIALS RESEARCH, v.12, no.12, pp.3367 - 3372, 1997-12 |
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