Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 6041 to 6060 of 19303
| Evaluation of reliability and development of auxiliary materials to enhance the performance of silver nanowire transparent electrodes = 은 나노선 기반 유연 투명전극의 한계 극복을 위한 보조재 개발 및 신뢰성 평가link Park, Minkyu; Han, Seung Min; et al, 한국과학기술원, 2018 |
| Evaluation of retention loss phenomena in heteroepitaxial PbTiO3 thin films with single c-domain structure fabricated at low temperature for SPM-based data storage application Choi, Si-Kyung; Ahn, WS; Jung, WW, The 2nd Student-Organizing International Mini-Conference on Information Electronics System, 2004 |
| Evaluation of stress corrosion susceptibility of stainless steels by repassivation kinetics 권혁상; Muhammad, Ejaz; 하헌영, 한국부식방식학회 학술대회, pp.0 - 0, 한국부식방식학회, 2003-05-01 |
| Evaluation of Temper Embrittlement Effect and Segregation Behaviors on Ni-Mo-Cr High Strength Low Alloy RPV Steels with Changing P and Mn Contents Park, Sang Gyu; Kim, Min-Chul; Lee, Bong-Sang; Wee, Dang-Moon, KOREAN JOURNAL OF METALS AND MATERIALS, v.48, no.2, pp.122 - 132, 2010-02 |
| Evaluation of Thermal Shear Strains in Flips-chip Package by Electronic Speckle Pattern Interferometry (ESPI) Jang, W; Lee, BW; Kim, DW; Nah, JW; Paik, Kyung-Wook; Kwon, D, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2001, pp.310 - 314, 2001-11 |
| Evaluation of tin nitride (Sn3N4) via atomic layer deposition using novel volatile Sn precursors Park, Hyeonbin; Choi, Heenang; Shin, Sunyoung; Park, Bo Keun; Kang, Kibum; Ryu, Ji Yeon; Eom, Taeyong; et al, DALTON TRANSACTIONS, v.52, no.41, pp.15033 - 15042, 2023-10 |
| Evaluation on fracture resistance of thin glass/polymer bilayer from static and dynamic indentation by pen tip Kim, Dong Gyu; Kong, Jung Hoon; Baek, Seungjin; Kim, Seungho; Hwang, Seongjin; Kin, Sanghoon; Kim, Do Kyung, 8th International Congress on Ceramics, The Korean Ceramic Society, 2021-04-25 |
| Evaporating polygonal shape of multi-component droplets in a confined space suppresses coffee-ring effects Pyeon, Jeongsu; Song, Kyeongmin; Jung, Yeon Sik; Kim, Hyoungsoo, 74th Annual Meeting of the APS Division of Fluid Dynamics, APS DFD 2021, American Physical Society (APS), 2021-11-22 |
| Evidence for forward domain growth being rate-limiting step in polarization switching in < 111 >-oriented-Pb(Zr0.45Ti0.55)O-3 thin-film capacitors Hong, SB; Setter, N, APPLIED PHYSICS LETTERS, v.81, no.18, pp.3437 - 3439, 2002-10 |
| EVIDENCE OF LONG-RANGE DIFFUSION OF NITROGEN IN CELLULAR PRECIPITATION OF CR2N IN CR-NI AUSTENITIC STEEL KAJIHARA, M; Choi, Si-Kyung; KIKUCHI, M; TANAKA, R; SEO, Y; OKUMURA, T; KONDOH, Y, ZEITSCHRIFT FUR METALLKUNDE, v.77, no.8, pp.515 - 518, 1986-08 |
| Evolution mechanisms of the surface morphology of grains in ZnO thin films grown on p-InP substrates due to thermal annealing Yuk, Jong Min; Lee, Jeong-Yong; No, Y. S.; Kim, T. W.; Choi, W. K., APPLIED PHYSICS LETTERS, v.93, no.2, 2008-07 |
| Evolution of grain structure of as-deposited Cr thin films with deposition temperature Park, Joong Keun; Kim, JH; Park, SI; Lee, HyuckMo; Oh, DY, SCRIPTA MATERIALIA, v.48, no.8, pp.1161 - 1166, 2003-04 |
| Evolution of Mesostructures in Fluorinated Organosilicate Thin Films Bae, Byeong-Soo; Jung, JI; Bae, JY, The 4th International Mesostructured Materials Symposium, 2004 |
| Evolution of microstructure characteristics during the electron-beam-induced phase transition of aluminum trihydroxide Kim, YM; Kim, YS; Lee, S; Kim, YJ; Lee, JeongYong, SCRIPTA MATERIALIA, v.61, pp.572 - 575, 2009-09 |
| Evolution of Microstructure during Sintering of Ceramics Kang, Suk-Joong L, Inter. Ceramic Congress (CIMTEC 2014), Consiglio Nazionale delle Ricerche, 2014-06-12 |
| Evolution of Microstructure during Sintering of Ceramics Kang, Suk-Joong L, 13th Inter. Ceramic Congress (CIMTEC2014), CIMTEC, 2014-06-12 |
| Evolution of strength and microstructure during annealing of heavily cold-drawn 6.3 GPa hypereutectoid pearlitic steel wire Li, Y. J.; Choi, Pyuck-Pa; Goto, S.; Borchers, C.; Raabe, D.; Kirchheim, R., ACTA MATERIALIA, v.60, no.9, pp.4005 - 4016, 2012-05 |
| Evolution of Stress With Film Thickness in Co Films on InP(001) Park, YS; Jeong, JR; Jeong, JS; Lee, JeongYong; Shin, SC, IEEE TRANSACTIONS ON MAGNETICS, v.45, pp.2523 - 2526, 2009-06 |
| Evolution of surface morphology in Ni(γ)/Ni3Al(γ´) two-phase foils during electrochemical etching H.Y.LEE; M.Demura; Y.Xu; Wee, Dang-Moon; T.Hirano, ADVANCED MATERIALS RESEARCH, v.89-91, pp.331 - 336, 2010-01 |
| Evolution of surface morphology in Ni/Ni3Al two-phase foil during electrochemical etching Lee, HY; Demura, M; Xu, Y; Wee, Dang-Moon; Hirano, T, 6th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2009, pp.331 - 336, 123, 2009-08-25 |
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