Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 3561 to 3580 of 7308
| Interfacial Heat Transfer Coefficient Between Casting and Mold Zin-Hyoung Lee, International Conference on High-New Technology and traditional Industry, 1996 |
| Interfacial microstructure and bonding strength of ceramic/metal joined with brazing 최시경; Park, SY, 대한 용접 학회, pp.129 -, 1991 |
| Interfacial perpendicular magnetic anisotropy in CoFeB/MgO structure with various underlayers Oh, Young-wan; Lee, Kyeong-dong; Jeong, Jong-yul; Park, Byong Guk, 58th annual conference on magneitsm and magnetic materials, American Institute of Physics, 2013-11-05 |
| Interfacial reaction and control of Pt/PZT/Pt by sol-gel process No, Kwangsoo, AMF, AMF, 1998-01-01 |
| Interfacial Reaction Between 42Sn/58Si solder and Electroless Ni-p/Immersion Au UBM During Theraml Aging Cho, Moon Gi; Paik, Kyung Wook; Lee, Hyuck-Mo, 134th TMS Annual Meeting & Exhibition, TMS, 2005-02-15 |
| Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs Paik, Kyung-Wook; Jeon, YD; Cho, MG, Proceedings - 54th Electronic Components and Technology Conference, pp.675 - 682, IEEE, 2004-06-01 |
| Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations Jee, YK; Kim, JY; Yu, Jin; Lee, TY, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.S1-b p3 -, 2007-11-19 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn solder with Ni-PUBM during Thermal Aging Lee, Hyuck Mo, 2009 TMS annual meeting (138th), 2009-03-17 |
| Interfacial Reactions between Lead-free Solders and Ni/Cu Dual-layer UBM Yu, Jin; Kim, JY; Sohn, YC, Micro System Technologies 2005 Proceedings, pp.337 - 344, 2005 |
| Interfacial Structure of the Discontinuously Precipitated Lamelle in Fe-31.3Mn-8.7Al-2.0C Alloy Choo, Woong Kil, MRS Research Symposia Proc. Materials Research Society, pp.175 - 179, 1988 |
| Interfacial Studies on Cr and Ti Deposited on BCB film Paik, Kyung-Wook, Proc. Mat. Res. Soc. Symp, pp.309 - 314, 1991-03-01 |
| Interfacial Studies on the Electroplated Eutectic Pb/Sn Flip-Chip Solder Bump and UBM (Under Bump Metallurgy) Paik, Kyung-Wook, International Conference on Electronic Materials, pp.0 - 0, 1998-05-01 |
| Interfering Effects of NO and SO2 Gases on Electrochemical CO2 Sensor Park, Chong-Ook; Hong, HS; Kim, JW; Jung, SJ, The 9th Asian Conference on solid state ionics, pp.693 - 698, 2004 |
| Internal Stress Superplasticity in Metal Matrix Composites Hong, Soon-Hyung; Gonzalez, G; McCann, R; Divecha, AP; karmarkar, SD; Sherby, OD, Proc. of 19th Inter. SAMPE Tech. Conf., pp.619 - 629, 1987 |
| Internal stresses evolution of non conductive pastes (NCPs) and underfill materials for flip chip applications Jang, KW; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1486 - 1490, IEEE, 2005-05-31 |
| International Thin Film Transistors Conference 2005 (ITS 2005) Ahn, Byung Tae, International TFT Conference Organizing Committee, 2005-03-01 |
| Interwoven 1-d Carbon as a Porous Scaffold for Li-Sulfur Batteries 윤종혁; 김도경; 김주형; 이현욱, 2018년도 한국재료학회 추계학술대회, 한국재료학회, 2018-11-08 |
| Intrinsic degradation of V-Ti based alloy by thermally induced hydrogen absorption-desorption cycling Lee, Jai Young, Japan-Korea Joint Symposium on Hydrogen Energy, pp.195 - 199, 1997 |
| Intrinsic degradation of V-Ti based by thermal induced hydrogen absorption-desorption Lee, Jai Young, International Symposium on Metal Hydrogen Systems : Fundamentals and Applications, 1998 |
| Intrinsic Stress Dependence of C-axis Orientation of PbTi03 Thin film by D.C Magnetron Sputtering 최시경; Yi, SH, 한국요업학회, pp.46 -, 1995 |
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