Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 3021 to 3040 of 19253
| Creep behavior of CVD-SiC Coating at HIgh Temperatures using BSR Method Umair, Nisar; Lee, Hyun Min; Kim, Do Kyung, 2012년 한국세라믹학회 추계총회 및 연구발표회, 한국세라믹학회, 2012-10-19 |
| CREEP CAVITATION IN A NICR STEEL CHO, HC; Yu, Jin; PARK, IS, METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, v.23, no.1, pp.201 - 210, 1992-01 |
| Creep crack growth in brittle materials Jeon, JY; Lee, YS; Yu, Jin, INTERNATIONAL JOURNAL OF FRACTURE, v.101, no.3, pp.203 - 214, 2000-02 |
| Creep Damage under the Creep-Fatigue Interaction Conditions in Lamellar Structured TiAl alloy Nam, Soo Woo, Third International Symposium on Structural Intermetallics, The Minerals, Metals and Materials Society, 2001 |
| Creep Deformatin Characteristics of the Lamellar TiAl Alloys Related with Microstructure Nam, Soo Woo, The 3rd Pacific Rim International Conference on Advanced Materials and Processing, pp.2479 - 2488, 1998 |
| Creep deformation behavior of mechanically alloyed Al-10Ti-2Si alloy Choi, CJ; Park, Joong Keun; Park, WW, SCRIPTA MATERIALIA, v.36, no.7, pp.769 - 774, 1997-04 |
| Creep Deformation Behavior of SiC Particle Reinforced 2024Al Matrix Composites Hong, Soon-Hyung, pp.221 - 232, 1991-01-01 |
| Creep Deformation Behaviors of Tin Pest Resistant Solder Alloys Yu, Jin; Kim, SB; Sohn, YC, ICEP 2005, pp.196 - 201, 2005 |
| Creep deformation of lead-free Sn-3.5Ag-Bi solders Shin, SW; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.42, no.3, pp.1368 - 1374, 2003-03 |
| Creep Deformation of Microstructurally Stable Sn-3.5Ag-xBi Solders Yu, Jin; Shin, SW, Proc.3rd Electronic Materials and Packaging, pp.229 - 234, 2001 |
| Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints Shin, SW; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.2, pp.188 - 195, 2005-02 |
| Creep Properties of Directionally Solidified TiAl Alloys Using a Seeding Technique 위당문, JOURNAL OF THE KOREAN INSTITUTE OF METALS AND MATERIALS, v.40, no.1, pp.39 - 48, 2002-01 |
| Creep Properties of the TiAl Alloy Made by Hot Extrusion of a Blended Elemental Powder Mixture 남수우, Workshop on Gamma TiAl Alloys, pp.117 - 130, 1996 |
| Creep rupture of lead-free Sn-3.5Ag-Cu solders Joo, DK; Yu, Jin; Shin, SW, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.6, pp.541 - 547, 2003-06 |
| Creep 강도에 UTS 가 미치는 영향과 반복 인장 하중이 Al-Zn 계의 creep 거동에 미치는 영향에 대한 연구 = Effect of UTS on creep strength and cyclic loading effect on the creep deformation in Al-Zn solid solutionlink 신동혁; Shin, Dong-Hyuk; et al, 한국과학기술원, 1979 |
| Creep(소성변형 및 가공) 유진, Proc. Plastic Deformation and Working (Bando Pub. Co.), pp.340 - 367, 1988 |
| Creep, Creep-Fatigue and Continuous Fatigue Deformation Characteristics of Lamellar TiAl Alloy Nam, Soo Woo, The Second International Conference on Light Materials for Transfortation Systems, 2001 |
| Creep-fatigue Behavior of Commercial and P-doped 304L Stainless Steel 남수우, 2nd conference on Mechanical Behaviors of Materials, pp.113 - 120, 1988 |
| Creep-Fatigue Interaction Behaviour of Near-alpha Ti-1100 alloy related with Microstructure Nam, Soo Woo, ICM-8, Eighth International Conference on Mechanical Behaviour of Materials, 1999 |
| Creep-Fatigue Interaction in AISI 4140 Steel 남수우, Proceedings of the First ROK-ROC Joint Workshop on Fracture of Metals, 1983 |
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