Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title 

Showing results 15981 to 16000 of 19302

15981
Wear-mechanical properties of filler-added liquid silicon infiltration C/C-SiC composites

Kim, Se Young; Han, In Sub; Woo, Sang Kuk; Lee, Kee Sung; Kim, Do Kyung, MATERIALS & DESIGN, v.44, pp.107 - 113, 2013-02

15982
Wearable lead-free piezoelectric blood pressure sensor based on Li-doped KNN for non-invasive blood pressure monitoring = 비침습식 혈압 모니터링을 위한 Li-doped KNN 기반 웨어러블 무연 압전 혈압센서link

An, Jae Hun; Lee, Keon Jae; et al, 한국과학기술원, 2022

15983
Wearable MicroLED: Device, Packaging and Transfer

Lee, Keon Jae, IMID 2019, The Korean Information Display Society, The Society for Information Display, The Korea Display Industry Association, 2019-08-30

15984
Wearable Piezoelectric Blood Pressure Sensor for Continuous Healthcare Monitoring

민성욱; 김동현; 이건재, 2022년 한국센서학회 추계학술대회, 한국센서학회, 2022-08-24

15985
Wearable Sensors with the Multi Local Strain Using 3D Textile Structure for Detecting Human Body Signals

Cho, Yujang; Ahn, Seongcheol; Kim, Il-Doo, The International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE), The Korean Institute of metals and materials, 2022-11-07

15986
Wearable Surface-Lighting Micro-Light-Emitting Diode Patch for Melanogenesis Inhibition

Lee, Jae Hee; Ahn, Yuri; Lee, Han Eol; Jang, You Na; Park, A. Yeon; Kim, Shinho; Jung, Young Hoon; et al, ADVANCED HEALTHCARE MATERIALS, v.12, no.1, 2023-01

15987
Wearable Textile Battery Rechargeable by Solar Energy

Lee, Yong-Hee; Kim, Joo-Seong; Noh, Jonghyeon; Lee, Inhwa; Kim, Hyeongjun; Choi, Sunghun; Seo, Jeongmin; et al, Nano Letters, v.13, no.11, pp.5753 - 5761, 2013-11

15988
Wearable Thin-Film Electronics via Laser-Based Lift-Off Process

Lee, Haneol; Lee, Keon Jae, International Conference On Advanced Electromaterials(ICAE) 2017, The Korean Institute of Electrical and Electronic Material Engineers, 2017-11-23

15989
Wearable Transparent Oxide Thin-Film Transistor Via Inorganic- Based Laser Lift-Off

Lee, Haneol; Lee, Keon Jae, 제 23회 한국반도체학술대회, 성균관대학교, 한국반도체산업협회, 한국반도체연구조합, 2016-02-24

15990
Weldability of High Strength Aluminum Alloy

남수우, Proc. of KWS-KIM symp. on Advanced Processing and Mechanical Properties of Aluminum Alloys, pp.29 - 38, 1992

15991
Weldability of High Strength Aluminum Alloy in Gas Tungsten Arc Weldments

남수우, 재료강도심포지엄, pp.423 - 430, 1998

15992
Well-distributed nanoscale catalysts on porous WO3 nanofibers using self-assembly of catalysts on polystyrene colloid templates and its chemical sensing capability

Choi, Seon Jin; Kim, Sang Joon; Cho, Hee Jin; Jang, Ji Soo; Kim, Il Doo, The 16th International Meeting on Chemical Sensors, The Korean Sensors Society, 2016-07

15993
Well-Ordered Nanostructure SiC Ceramic Derived from Self-Assembly of Polycarbosilane-Block-Poly(methyl methacrylate) Diblock Copolymer

Nghiem, Quoc Dat; Kim, Dong-Pyo; Kim, Sang Ouk, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.8, no.10, pp.5527 - 5531, 2008-10

15994
Well-Ordered Thin-Film Nanopore Arrays Formed Using a Block-Copolymer Template

Jung, Yeon Sik; Ross, Caroline A., SMALL, v.5, no.14, pp.1654 - 1659, 2009-07

15995
Wet oxidation 이 10nm 두께이하의 silicon nitride film 의 전기적 특성에 미치는 영향 = Effects of wet oxidation on the electrical properties of a sub-10nm thick silicon nitride filmslink

이은구; Lee, Eun-Gu; et al, 한국과학기술원, 1991

15996
Wet Pretreatment-Induced Modification of Cu(In,Ga)Se-2/Cd-Free ZnTiO Buffer Interface

Hwang, Suhwan; Liudmila, Larina; Lee, Hojin; Kim, Suncheul; Choi, Kyoung Soon; Jeon, Cheolho; Ahn, Byung Tae; et al, ACS APPLIED MATERIALS & INTERFACES, v.10, no.24, pp.20920 - 20928, 2018-06

15997
Wettability and interfacial morphology of Sn-3.0Ag-0.5Cu solder on electroless nickel plated ZnS transparent ceramic

Zhang, Shuye; Zhu, Bingxuan; Zhou, Xiang; Wang, Xingxing; Lin, Tiesong; He, Peng; Paik, Kyung-Wook, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.30, no.19, pp.17972 - 17985, 2019-10

15998
Wettability and Interfacial Reactions of Sn-based Pb-free Solders with Cu-xZn Alloy UBMs

Lee, Hyuck Mo, Korean Journal of Metal and Materials, 2008-04-24

15999
Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies

Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04

16000
Wetting Properties and Interfacial Reaction of Cu5Zn8-Bearing Pb-Free Solder on the Cu substrate by Mecanical Alloying

Lee, Hyuck Mo, 2009 TMS annual meeting (138th), 2009-03-17

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