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Interface and microstructural characterization of phosphorus doped silicon on silicon substrate for contact plug = 컨택 플러그용 인 도핑된 실리콘의 계면 및 미세구조 특성 연구link Im, Dong-Hyun; 임동현; et al, 한국과학기술원, 2016 |
The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05 |
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