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Effects of Flux Activator Addition in Nanofiber/Solder Anisotropic Conductive Films (ACFs) on the Solder Wettability of Flex-on-Flex (FOF) Assembly Lee, Ji-Soo; Kim, Ji-Hye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.7, pp.1316 - 1322, 2018-07 |
Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link Son, Ho-Young; 손호영; et al, 한국과학기술원, 2008 |
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