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High-speed flex-on-board assembly method using anisotropic conductive films (ACFs) combined with room temperature ultrasonic (US) bonding for high-density module interconnection in mobile phones Lee, K; Oh, S; Saarinen, I.J; Pykari, L; Paik, Kyung-Wook, 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.530 - 536, ECTC, 2011-05-31 |
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