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Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09 |
Electric characteristics of organic thin-film transistors and logic circuits with a ferroelectric gate insulator Yang, Yong Suk; Chu, Hye Yong; Kim, Seong Hyun; Lim, Sang Chul; Koo, Jae Bon; Lee, Jung Hun; Ku, Chan Hoe; et al, THIN SOLID FILMS, v.515, no.19, pp.7688 - 7691, 2007-07 |
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