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Brittle Failure and Effect of Thermal Aging on Pb-free Solder Flip Chip Using Electroless Ni-P UBM Kwon,Yong-Min; Jeon,Young-Doo; Paik, Kyung-Wook; Kin, Jung-Do; Lee, Jin-Woo, ELECTRONIC MATERIALS LETTERS, v.2, no.1, pp.37 - 42, 2006-03 |
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01 |
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