DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jeon, Insu | ko |
dc.contributor.author | Kang, Ki-Ju | ko |
dc.contributor.author | Im, Seyoung | ko |
dc.date.accessioned | 2010-04-28T06:45:36Z | - |
dc.date.available | 2010-04-28T06:45:36Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05 | - |
dc.identifier.citation | MICROELECTRONICS RELIABILITY, v.48, no.5, pp.749 - 756 | - |
dc.identifier.issn | 0026-2714 | - |
dc.identifier.uri | http://hdl.handle.net/10203/17986 | - |
dc.description.abstract | Stress intensities of a singular near-tip field around the vertex of a triple junction wedge in multilevel thin film packages are calculated using the two-state M-integral. For this calculation the existence of a simple auxiliary field in the sense of the M-integral associated with every eigenfunction for the triple junction vertex is first verified numerically. The auxiliary field is then employed for superposition with the elastic field under consideration, and the associated two-state M-integral is computed via the domain integral technique. This enables us to extract the stress intensity of each singular eigenfunction for the triple junction vertex at three different junction angles, alpha = 45 degrees, 90 degrees and 135 degrees. (C) 2008 Elsevier Ltd. All rights reserved. | - |
dc.description.sponsorship | This work was supported by the Korea Science and Engineering Foundation (KOSEF) grant funded by the Korea government (MOST) (R0A-2007-000-20115-0). | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | CONSERVATION-LAWS | - |
dc.subject | LAMINATED COMPOSITE | - |
dc.subject | TIP | - |
dc.subject | ELASTICITY | - |
dc.subject | CRACKS | - |
dc.subject | WEDGES | - |
dc.title | Stress intensities at the triple junction of a multilevel thin film package | - |
dc.type | Article | - |
dc.identifier.wosid | 000256611400012 | - |
dc.identifier.scopusid | 2-s2.0-43049174566 | - |
dc.type.rims | ART | - |
dc.citation.volume | 48 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 749 | - |
dc.citation.endingpage | 756 | - |
dc.citation.publicationname | MICROELECTRONICS RELIABILITY | - |
dc.identifier.doi | 10.1016/j.microrel.2007.12.004 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Im, Seyoung | - |
dc.contributor.nonIdAuthor | Jeon, Insu | - |
dc.contributor.nonIdAuthor | Kang, Ki-Ju | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | CONSERVATION-LAWS | - |
dc.subject.keywordPlus | LAMINATED COMPOSITE | - |
dc.subject.keywordPlus | TIP | - |
dc.subject.keywordPlus | ELASTICITY | - |
dc.subject.keywordPlus | CRACKS | - |
dc.subject.keywordPlus | WEDGES | - |
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