Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, KD | ko |
| dc.contributor.author | Park, J | ko |
| dc.contributor.author | Lee, JG | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Lee, JH | ko |
| dc.date.accessioned | 2010-03-24T07:47:31Z | - |
| dc.date.available | 2010-03-24T07:47:31Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2005-06 | - |
| dc.identifier.citation | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, pp.557 - 559 | - |
| dc.identifier.issn | 0895-2477 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/17306 | - |
| dc.description.abstract | In this paper, we propose structures for noise- coupling reduction between adjacent packages and dense multichip modules (MCMs), which are classified as (i) grounded-moating and (ii) shielding structures, and (iii) a combination of them. Good agreeement from a 3D finite-element method (3D-FEM) electromagnetic characterization and experimental verification of each structure are presented. (c) 2005 Wiley Periodicals, Inc. | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | JOHN WILEY & SONS INC | - |
| dc.title | Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000229170100026 | - |
| dc.identifier.scopusid | 2-s2.0-20444455426 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 45 | - |
| dc.citation.beginningpage | 557 | - |
| dc.citation.endingpage | 559 | - |
| dc.citation.publicationname | MICROWAVE AND OPTICAL TECHNOLOGY LETTERS | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, KD | - |
| dc.contributor.nonIdAuthor | Park, J | - |
| dc.contributor.nonIdAuthor | Lee, JG | - |
| dc.contributor.nonIdAuthor | Lee, JH | - |
| dc.type.journalArticle | Article | - |
| dc.subject.keywordAuthor | shielding | - |
| dc.subject.keywordAuthor | noise coupling | - |
| dc.subject.keywordAuthor | multichip modules | - |
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