A versatile patterning method for 3-dimensional complex pattern with 10nm scale over large area by secondary sputtering phenomenon

Abstract

The development of large-area nano-patterning with high resolution, high aspect ratio and simple process scheme/cost is a challenging work for realizing their potential applications in opto-electronics and nano-biotechnology such as nanoelectronics, optics, optical sensing, light-emitting devices and bio-sensing devices. Unlike previous nano-fabrication techniques reported thus far, our method has several powerful advantages such as high resolution(~10nm) and high aspect ratio(~15), easy fabrication process over large area, wide range of materials available, 3-dimensional complex nano-structure and easy controlling of pattern feature. Thus, our novel patterning technology will be able to introduce new concepts for fabricating high performance of future nanoscale devices.