Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Manho | ko |
| dc.contributor.author | Cho,Jonghyun | ko |
| dc.contributor.author | Kim, Joohee | ko |
| dc.contributor.author | Pak, Jun So | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Lee, Hyungdong | ko |
| dc.contributor.author | Lee, Junho | ko |
| dc.contributor.author | Park, Kunwoo | ko |
| dc.date.accessioned | 2013-03-29T13:14:44Z | - |
| dc.date.available | 2013-03-29T13:14:44Z | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.created | 2012-07-06 | - |
| dc.date.issued | 2011-10-24 | - |
| dc.identifier.citation | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.uri | http://hdl.handle.net/10203/170943 | - |
| dc.language | English | - |
| dc.publisher | EPEP 2011 | - |
| dc.title | Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000299429300056 | - |
| dc.identifier.scopusid | 2-s2.0-84855395647 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Lee, Manho | - |
| dc.contributor.nonIdAuthor | Cho,Jonghyun | - |
| dc.contributor.nonIdAuthor | Kim, Joohee | - |
| dc.contributor.nonIdAuthor | Lee, Hyungdong | - |
| dc.contributor.nonIdAuthor | Lee, Junho | - |
| dc.contributor.nonIdAuthor | Park, Kunwoo | - |
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