DC Field | Value | Language |
---|---|---|
dc.contributor.author | Song, Eunseok | ko |
dc.contributor.author | Koo, Kyoungchoul | ko |
dc.contributor.author | Kim, Myunghoi | ko |
dc.contributor.author | Park, Jun So | ko |
dc.contributor.author | Kim Joungho | ko |
dc.date.accessioned | 2013-03-29T13:14:11Z | - |
dc.date.available | 2013-03-29T13:14:11Z | - |
dc.date.created | 2012-07-06 | - |
dc.date.created | 2012-07-06 | - |
dc.date.created | 2012-07-06 | - |
dc.date.issued | 2011-10-24 | - |
dc.identifier.citation | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
dc.identifier.uri | http://hdl.handle.net/10203/170940 | - |
dc.language | English | - |
dc.publisher | EPEP 2011 | - |
dc.title | Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs | - |
dc.type | Conference | - |
dc.identifier.wosid | 000299429300053 | - |
dc.identifier.scopusid | 2-s2.0-84855385277 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 20th Conference on Electrical Performance of Electronic Packaging and Systems | - |
dc.identifier.conferencecountry | US | - |
dc.contributor.localauthor | Kim Joungho | - |
dc.contributor.nonIdAuthor | Song, Eunseok | - |
dc.contributor.nonIdAuthor | Koo, Kyoungchoul | - |
dc.contributor.nonIdAuthor | Kim, Myunghoi | - |
dc.contributor.nonIdAuthor | Park, Jun So | - |
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