DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jin Kwan | - |
dc.contributor.author | Lee, Hee Chul | - |
dc.date.accessioned | 2013-03-29T11:55:03Z | - |
dc.date.available | 2013-03-29T11:55:03Z | - |
dc.date.created | 2012-07-06 | - |
dc.date.issued | 2012-06 | - |
dc.identifier.citation | AWAD, 2012 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/170516 | - |
dc.language | ENG | - |
dc.title | A chip scale wafer level packaging for LED using surface aligning technique | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | AWAD, 2012 Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Hee Chul | - |
dc.contributor.nonIdAuthor | Kim, Jin Kwan | - |
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