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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Channel Design for Wide System Bandwidth in a TSV based 3D IC

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dc.contributor.authorKim, Heegonko
dc.contributor.authorCho, Jonghyunko
dc.contributor.authorKim, Jooheeko
dc.contributor.authorKim, Myunghoiko
dc.contributor.authorLee, Junhoko
dc.contributor.authorLee, Hyungdngko
dc.contributor.authorPark, Kunwoko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2013-03-29T11:43:09Z-
dc.date.available2013-03-29T11:43:09Z-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.issued2010-12-
dc.identifier.citation2011 Signal Propagation on Interconnects-
dc.identifier.urihttp://hdl.handle.net/10203/170454-
dc.languageEnglish-
dc.publisher2011 Signal Propagation on Interconnects-
dc.titleChannel Design for Wide System Bandwidth in a TSV based 3D IC-
dc.typeConference-
dc.identifier.wosid000299281100013-
dc.identifier.scopusid2-s2.0-79960898433-
dc.type.rimsCONF-
dc.citation.publicationname2011 Signal Propagation on Interconnects-
dc.identifier.conferencecountryIT-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Heegon-
dc.contributor.nonIdAuthorCho, Jonghyun-
dc.contributor.nonIdAuthorKim, Joohee-
dc.contributor.nonIdAuthorKim, Myunghoi-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorLee, Hyungdng-
dc.contributor.nonIdAuthorPark, Kunwo-
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EE-Conference Papers(학술회의논문)
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