DSpace at KOASAS
College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Through-Silicon Via (TSV) Depletion Effect

Cited 11 time in webofscience Cited 0 time in scopus
  • Hit : 744
  • Download : 0
Export
DC FieldValueLanguage
dc.contributor.authorCho, Jonghyunko
dc.contributor.authorKim, Myunghoiko
dc.contributor.authorKim, Jooheeko
dc.contributor.authorPak, Jun Soko
dc.contributor.authorKim, Jounghoko
dc.contributor.authorLee, Hyungdongko
dc.contributor.authorLee, Junhoko
dc.contributor.authorPak, Kunwooko
dc.date.accessioned2013-03-29T11:38:04Z-
dc.date.available2013-03-29T11:38:04Z-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.issued2011-10-24-
dc.identifier.citation20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.urihttp://hdl.handle.net/10203/170426-
dc.languageEnglish-
dc.publisherEPEP 2011-
dc.titleThrough-Silicon Via (TSV) Depletion Effect-
dc.typeConference-
dc.identifier.wosid000299429300023-
dc.identifier.scopusid2-s2.0-84855409527-
dc.type.rimsCONF-
dc.citation.publicationname20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorCho, Jonghyun-
dc.contributor.nonIdAuthorKim, Myunghoi-
dc.contributor.nonIdAuthorKim, Joohee-
dc.contributor.nonIdAuthorLee, Hyungdong-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorPak, Kunwoo-
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 11 items in WoS Click to see citing articles in records_button

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0