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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Through-Silicon Via (TSV) Depletion Effect

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dc.contributor.authorCho, Jonghyunko
dc.contributor.authorKim, Myunghoiko
dc.contributor.authorKim, Jooheeko
dc.contributor.authorPak, Jun Soko
dc.contributor.authorKim, Jounghoko
dc.contributor.authorLee, Hyungdongko
dc.contributor.authorLee, Junhoko
dc.contributor.authorPak, Kunwooko
dc.date.accessioned2013-03-29T11:38:04Z-
dc.date.available2013-03-29T11:38:04Z-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.created2012-07-06-
dc.date.issued2011-10-24-
dc.identifier.citation20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.urihttp://hdl.handle.net/10203/170426-
dc.languageEnglish-
dc.publisherEPEP 2011-
dc.titleThrough-Silicon Via (TSV) Depletion Effect-
dc.typeConference-
dc.identifier.wosid000299429300023-
dc.identifier.scopusid2-s2.0-84855409527-
dc.type.rimsCONF-
dc.citation.publicationname20th Conference on Electrical Performance of Electronic Packaging and Systems-
dc.identifier.conferencecountryUS-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorCho, Jonghyun-
dc.contributor.nonIdAuthorKim, Myunghoi-
dc.contributor.nonIdAuthorKim, Joohee-
dc.contributor.nonIdAuthorLee, Hyungdong-
dc.contributor.nonIdAuthorLee, Junho-
dc.contributor.nonIdAuthorPak, Kunwoo-
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EE-Conference Papers(학술회의논문)
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