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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Journal Papers(저널논문)

Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications

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dc.contributor.authorPark, Jko
dc.contributor.authorLu, ACWko
dc.contributor.authorChua, KMko
dc.contributor.authorWai, LLko
dc.contributor.authorLee, Jko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2010-03-05T08:16:30Z-
dc.date.available2010-03-05T08:16:30Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-09-
dc.identifier.citationIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.481 - 483-
dc.identifier.issn1531-1309-
dc.identifier.urihttp://hdl.handle.net/10203/16988-
dc.description.abstractWe propose a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The DS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in system-in-package (SiP) applications. Our design approach was enabled by combining two EBG layers embedded between the power and ground planes. The two EBG layers had different bandgaps from using different cell sizes. Enhanced wideband suppression of the SSN coupling was validated using a 11.4-GHz noise stop bandwidth with 30-dB isolation in time and frequency domain measurements up to 20 GHz.-
dc.description.sponsorshipThis work was supported by the Radio Detection Research Center, Agency for Defense Development, Korea, and by the Singapore Institute of Manufacturing Technology, A *STAR, Singapore.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectMITIGATION-
dc.titleDouble-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP applications-
dc.typeArticle-
dc.identifier.wosid000240446000001-
dc.identifier.scopusid2-s2.0-33748337747-
dc.type.rimsART-
dc.citation.volume16-
dc.citation.beginningpage481-
dc.citation.endingpage483-
dc.citation.publicationnameIEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS-
dc.identifier.doi10.1109/LMWC.2006.880719-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorPark, J-
dc.contributor.nonIdAuthorLu, ACW-
dc.contributor.nonIdAuthorChua, KM-
dc.contributor.nonIdAuthorWai, LL-
dc.contributor.nonIdAuthorLee, J-
dc.type.journalArticleArticle-
dc.subject.keywordAuthordouble-stacked EBG-
dc.subject.keywordAuthorelectromagnetic bandgap (EBG)-
dc.subject.keywordAuthorlow-temperature co-fired ceramic (LTCC)-
dc.subject.keywordAuthormixed-signal system-
dc.subject.keywordAuthorsimultaneous switching noise (SSN)-
dc.subject.keywordAuthorSSN coupling-
dc.subject.keywordAuthorsystem-in-package (SiP)-
dc.subject.keywordPlusMITIGATION-
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