DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, G. | ko |
dc.contributor.author | Kim, J. | ko |
dc.contributor.author | Lee, S. | ko |
dc.contributor.author | Kim, J. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2010-03-05T05:27:08Z | - |
dc.date.available | 2010-03-05T05:27:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-12-10 | - |
dc.identifier.citation | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96 | - |
dc.identifier.uri | http://hdl.handle.net/10203/16973 | - |
dc.description.sponsorship | This work was supported by the MKE/IITA (Ministry of Knowledge Economy/Institute for Information Technology Advancement) under the Information Technology Research and Development Program (2005-S-118-04, Development of High-Performance and Smallest SiP Technology). | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines | - |
dc.type | Conference | - |
dc.identifier.wosid | 000265245200025 | - |
dc.identifier.scopusid | 2-s2.0-60649117380 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 93 | - |
dc.citation.endingpage | 96 | - |
dc.citation.publicationname | 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Seoul | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, G. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
dc.contributor.nonIdAuthor | Lee, S. | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
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