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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Journal Papers(저널논문)

Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development

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dc.contributor.authorLee, Jung-Subko
dc.contributor.authorChu, Kun-Moko
dc.contributor.authorPatzelt, Rainerko
dc.contributor.authorManessis, Dionysiosko
dc.contributor.authorOstmann, Andreasko
dc.contributor.authorJeon, DukYoungko
dc.date.accessioned2010-03-04T01:59:15Z-
dc.date.available2010-03-04T01:59:15Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-07-
dc.identifier.citationMICROELECTRONIC ENGINEERING, v.85, no.7, pp.1577 - 1583-
dc.identifier.issn0167-9317-
dc.identifier.urihttp://hdl.handle.net/10203/16914-
dc.description.abstractIn this study, the approach of composite solder using eutectic Sn-3.5Ag solder and Co was tried. Co particles and Sn-3.5Ag solder paste were mechanically mixed at Co weight fractions from 0.1% to 2.0%. For the Co-mixed Sn-3.5Ag solder pastes, their melting temperatures and spreading areas were measured. The solder pastes were stencil printed on test substrates and reflowed to form solder bumps. Ball shear test was performed to examine shear strength of Co-reinforced Sn-3.5Ag solder bumps. As a result, Co addition up to 2 wt.% did not alter the melting temperature under heating but reduced undercooling. The maximum shear strength of Co-reinforced Sn-3.5Ag solder bumps increased by 28% compared to normal ones. The increase in shear strength can be attributed to the (CU,Co)(3)Sn-2 intermetallic compounds. (C) 2008 Elsevier B.V. All rights reserved.-
dc.description.sponsorshipThis work was supported by the Center for Electronic Packaging Materials (ERC) of MOST/KOSEF and the Joint Laboratory Program for CEPM-Fraunhofer IZM.en
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherELSEVIER SCIENCE BV-
dc.subjectCOMPOSITE SOLDERS-
dc.subjectCREEP-PROPERTIES-
dc.subjectPB-FREE-
dc.subjectJOINTS-
dc.subjectRESISTANT-
dc.subjectBEHAVIOR-
dc.subjectCU-
dc.titleEffects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development-
dc.typeArticle-
dc.identifier.wosid000258159900017-
dc.identifier.scopusid2-s2.0-45249119273-
dc.type.rimsART-
dc.citation.volume85-
dc.citation.issue7-
dc.citation.beginningpage1577-
dc.citation.endingpage1583-
dc.citation.publicationnameMICROELECTRONIC ENGINEERING-
dc.identifier.doi10.1016/j.mee.2008.03.002-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorJeon, DukYoung-
dc.contributor.nonIdAuthorLee, Jung-Sub-
dc.contributor.nonIdAuthorChu, Kun-Mo-
dc.contributor.nonIdAuthorPatzelt, Rainer-
dc.contributor.nonIdAuthorManessis, Dionysios-
dc.contributor.nonIdAuthorOstmann, Andreas-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorSn-3.5Ag-
dc.subject.keywordAuthorCo addition-
dc.subject.keywordAuthorcomposite solder-
dc.subject.keywordPlusCOMPOSITE SOLDERS-
dc.subject.keywordPlusCREEP-PROPERTIES-
dc.subject.keywordPlusPB-FREE-
dc.subject.keywordPlusJOINTS-
dc.subject.keywordPlusRESISTANT-
dc.subject.keywordPlusBEHAVIOR-
dc.subject.keywordPlusCU-
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