High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Seung-Ho | ko |
| dc.contributor.author | Kim, Young-Jae | ko |
| dc.contributor.author | Park, Ho Joon | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-29T07:38:35Z | - |
| dc.date.available | 2013-03-29T07:38:35Z | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.created | 2012-06-21 | - |
| dc.date.issued | 2012-05 | - |
| dc.identifier.citation | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/169094 | - |
| dc.language | English | - |
| dc.publisher | IEEE | - |
| dc.title | High Productivity and Damage-free Ultrasonic Anisotropic Conductive Film (ACF) Bonding for Touch Screen Panel (TSP) Assemblies | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000309162000281 | - |
| dc.identifier.scopusid | 2-s2.0-84866860468 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 62nd Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, Seung-Ho | - |
| dc.contributor.nonIdAuthor | Kim, Young-Jae | - |
| dc.contributor.nonIdAuthor | Park, Ho Joon | - |
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