Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yu, SY | ko |
| dc.contributor.author | Kwon, YM | ko |
| dc.contributor.author | Kim, J | ko |
| dc.contributor.author | Jeong, T | ko |
| dc.contributor.author | Choi, S | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-28T10:34:41Z | - |
| dc.date.available | 2013-03-28T10:34:41Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2011-05-31 | - |
| dc.identifier.citation | 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.460 - 466 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164924 | - |
| dc.language | English | - |
| dc.publisher | ECTC | - |
| dc.title | Study on the thermal cycle and drop test reliability of system-in-packages with an Embedded die | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000302341400069 | - |
| dc.identifier.scopusid | 2-s2.0-79960429255 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 460 | - |
| dc.citation.endingpage | 466 | - |
| dc.citation.publicationname | 2011 61st Electronic Components and Technology Conference, ECTC 2011 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Lake Buena Vista, FL | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Yu, SY | - |
| dc.contributor.nonIdAuthor | Kwon, YM | - |
| dc.contributor.nonIdAuthor | Kim, J | - |
| dc.contributor.nonIdAuthor | Jeong, T | - |
| dc.contributor.nonIdAuthor | Choi, S | - |
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