Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging

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dc.contributor.authorPark, YSko
dc.contributor.authorMoon, JTko
dc.contributor.authorLee, YWko
dc.contributor.authorLee, JHko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2013-03-28T09:35:34Z-
dc.date.available2013-03-28T09:35:34Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2011-05-31-
dc.identifier.citation2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1870 - 1877-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/164563-
dc.languageEnglish-
dc.publisherECTC-
dc.titleEffect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging-
dc.typeConference-
dc.identifier.wosid000302341400288-
dc.identifier.scopusid2-s2.0-79960395089-
dc.type.rimsCONF-
dc.citation.beginningpage1870-
dc.citation.endingpage1877-
dc.citation.publicationname2011 61st Electronic Components and Technology Conference, ECTC 2011-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationLake Buena Vista, FL-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorPark, YS-
dc.contributor.nonIdAuthorMoon, JT-
dc.contributor.nonIdAuthorLee, YW-
dc.contributor.nonIdAuthorLee, JH-
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MS-Conference Papers(학술회의논문)
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