DC Field | Value | Language |
---|---|---|
dc.contributor.author | Park, YS | ko |
dc.contributor.author | Moon, JT | ko |
dc.contributor.author | Lee, YW | ko |
dc.contributor.author | Lee, JH | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2013-03-28T09:35:34Z | - |
dc.date.available | 2013-03-28T09:35:34Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2011-05-31 | - |
dc.identifier.citation | 2011 61st Electronic Components and Technology Conference, ECTC 2011, pp.1870 - 1877 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/164563 | - |
dc.language | English | - |
dc.publisher | ECTC | - |
dc.title | Effect of fine solder ball diameters on intermetallic growth of Sn-Ag-Cu solder at Cu and Ni pad finish interfaces during thermal aging | - |
dc.type | Conference | - |
dc.identifier.wosid | 000302341400288 | - |
dc.identifier.scopusid | 2-s2.0-79960395089 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1870 | - |
dc.citation.endingpage | 1877 | - |
dc.citation.publicationname | 2011 61st Electronic Components and Technology Conference, ECTC 2011 | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Lake Buena Vista, FL | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Park, YS | - |
dc.contributor.nonIdAuthor | Moon, JT | - |
dc.contributor.nonIdAuthor | Lee, YW | - |
dc.contributor.nonIdAuthor | Lee, JH | - |
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