Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, YS | ko |
| dc.contributor.author | Kwon, YM | ko |
| dc.contributor.author | Moon, JT | ko |
| dc.contributor.author | Lee, YW | ko |
| dc.contributor.author | Lee, JH | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-28T09:17:48Z | - |
| dc.date.available | 2013-03-28T09:17:48Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2010-06-01 | - |
| dc.identifier.citation | 60th Electronic Components and Technology Conference, ECTC 2010, pp.1436 - 1441 | - |
| dc.identifier.issn | 0569-5503 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/164467 | - |
| dc.language | English | - |
| dc.publisher | ECTC | - |
| dc.title | Effects of fine size lead-free solder ball on the interfacial reactions and joint reliability | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000287024100223 | - |
| dc.identifier.scopusid | 2-s2.0-77955178017 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 1436 | - |
| dc.citation.endingpage | 1441 | - |
| dc.citation.publicationname | 60th Electronic Components and Technology Conference, ECTC 2010 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Las Vegas, NV | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Park, YS | - |
| dc.contributor.nonIdAuthor | Kwon, YM | - |
| dc.contributor.nonIdAuthor | Moon, JT | - |
| dc.contributor.nonIdAuthor | Lee, YW | - |
| dc.contributor.nonIdAuthor | Lee, JH | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
This item is cited by other documents in WoS
| ⊙ Detail Information in WoSⓡ | Click to see |  |
| ⊙ Cited 36 items in WoS | Click to see citing articles in |  |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.