DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, J. | - |
dc.contributor.author | Pak, J.S. | - |
dc.contributor.author | Cho, J. | - |
dc.contributor.author | Lee, J. | - |
dc.contributor.author | Lee, H. | - |
dc.contributor.author | Park, K. | - |
dc.contributor.author | Kim, Joungho | - |
dc.date.accessioned | 2013-03-28T09:00:34Z | - |
dc.date.available | 2013-03-28T09:00:34Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2010-08-24 | - |
dc.identifier.citation | 2010 IEEE CPMT Symposium Japan, ICSJ10, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/164333 | - |
dc.language | ENG | - |
dc.publisher | IEEE | - |
dc.title | Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-79251541505 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2010 IEEE CPMT Symposium Japan, ICSJ10 | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, J. | - |
dc.contributor.nonIdAuthor | Pak, J.S. | - |
dc.contributor.nonIdAuthor | Cho, J. | - |
dc.contributor.nonIdAuthor | Lee, J. | - |
dc.contributor.nonIdAuthor | Lee, H. | - |
dc.contributor.nonIdAuthor | Park, K. | - |
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