DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Ryung Hee | - |
dc.contributor.author | Han, Dong Wook | - |
dc.contributor.author | Nam, Do Hwan | - |
dc.contributor.author | Kim, Jeong Han | - |
dc.contributor.author | Kwon Hyuk-Sang | - |
dc.date.accessioned | 2013-03-28T05:28:01Z | - |
dc.date.available | 2013-03-28T05:28:01Z | - |
dc.date.created | 2012-07-16 | - |
dc.date.issued | 2009-11 | - |
dc.identifier.citation | 2009 International Conference on Nano Science and Nano Technology, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/163114 | - |
dc.language | ENG | - |
dc.publisher | Gwangju-Jeonnam Nano Science and Technology Union | - |
dc.title | Effects of Substrate Morphology on Adhesion and Pore Structure of Cu foam Prepared by Electrodeposition | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2009 International Conference on Nano Science and Nano Technology | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Kwon Hyuk-Sang | - |
dc.contributor.nonIdAuthor | Kim, Ryung Hee | - |
dc.contributor.nonIdAuthor | Han, Dong Wook | - |
dc.contributor.nonIdAuthor | Nam, Do Hwan | - |
dc.contributor.nonIdAuthor | Kim, Jeong Han | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.