DC Field | Value | Language |
---|---|---|
dc.contributor.author | Hong, Soon-Hyung | - |
dc.date.accessioned | 2013-03-27T10:49:08Z | - |
dc.date.available | 2013-03-27T10:49:08Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-04-26 | - |
dc.identifier.citation | Spring Meeting of The Korean Institute of Metals and Materials, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/161796 | - |
dc.language | KOR | - |
dc.publisher | 금속재료학회 | - |
dc.title | Effect of Dopant on Mechanical Properties of Au Bonding Wire for Electronic Package Applications | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | Spring Meeting of The Korean Institute of Metals and Materials | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Hong, Soon-Hyung | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.