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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Fabrication and characterization of SiOx/Parylene and SiNx/Parylene thin film encapsulation layers

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dc.contributor.authorKim N.-
dc.contributor.authorPotscavage, W.-
dc.contributor.authorKippelen, B.-
dc.contributor.authorYoo, Seunghyup-
dc.contributor.authorDomercq, B.-
dc.contributor.authorGraham, S.-
dc.date.accessioned2013-03-27T10:00:53Z-
dc.date.available2013-03-27T10:00:53Z-
dc.date.created2012-02-06-
dc.date.issued2007-07-08-
dc.identifier.citationASME Electronic and Photonics Packaging Division, v., no., pp.933 - 938-
dc.identifier.urihttp://hdl.handle.net/10203/161470-
dc.languageENG-
dc.titleFabrication and characterization of SiOx/Parylene and SiNx/Parylene thin film encapsulation layers-
dc.typeConference-
dc.identifier.scopusid2-s2.0-40549128045-
dc.type.rimsCONF-
dc.citation.beginningpage933-
dc.citation.endingpage938-
dc.citation.publicationnameASME Electronic and Photonics Packaging Division-
dc.identifier.conferencecountryCanada-
dc.identifier.conferencecountryCanada-
dc.contributor.localauthorYoo, Seunghyup-
dc.contributor.nonIdAuthorKim N.-
dc.contributor.nonIdAuthorPotscavage, W.-
dc.contributor.nonIdAuthorKippelen, B.-
dc.contributor.nonIdAuthorDomercq, B.-
dc.contributor.nonIdAuthorGraham, S.-
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EE-Conference Papers(학술회의논문)
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