Passive packaging solutions using the fiber-optic technology for optical-PCB-based interconnection systems
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Park, HyoHoon | - |
| dc.contributor.author | Lee, TW | - |
| dc.contributor.author | Hwang, SH | - |
| dc.contributor.author | Kim, DW | - |
| dc.date.accessioned | 2013-03-27T05:35:30Z | - |
| dc.date.available | 2013-03-27T05:35:30Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2008-03-15 | - |
| dc.identifier.citation | Electronics Circuits World Convention (ECWC) 11, v., no., pp.0 - 0 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/159585 | - |
| dc.language | ENG | - |
| dc.publisher | ECWC | - |
| dc.title | Passive packaging solutions using the fiber-optic technology for optical-PCB-based interconnection systems | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 0 | - |
| dc.citation.endingpage | 0 | - |
| dc.citation.publicationname | Electronics Circuits World Convention (ECWC) 11 | - |
| dc.identifier.conferencecountry | China | - |
| dc.identifier.conferencecountry | China | - |
| dc.contributor.localauthor | Park, HyoHoon | - |
| dc.contributor.nonIdAuthor | Lee, TW | - |
| dc.contributor.nonIdAuthor | Hwang, SH | - |
| dc.contributor.nonIdAuthor | Kim, DW | - |
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