DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, Kyung-Wook | - |
dc.contributor.author | Kim, Il | - |
dc.contributor.author | Son, Ho-Young | - |
dc.contributor.author | Chung, Chang-Kyu | - |
dc.date.accessioned | 2013-03-27T05:11:09Z | - |
dc.date.available | 2013-03-27T05:11:09Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008 | - |
dc.identifier.citation | Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, v., no., pp.0 - 0 | - |
dc.identifier.uri | http://hdl.handle.net/10203/159408 | - |
dc.language | ENG | - |
dc.title | Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 0 | - |
dc.citation.endingpage | 0 | - |
dc.citation.publicationname | Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kim, Il | - |
dc.contributor.nonIdAuthor | Son, Ho-Young | - |
dc.contributor.nonIdAuthor | Chung, Chang-Kyu | - |
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