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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

An X-band high power amplifier module package using selectively anodized aluminum substrate

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dc.contributor.authorYeo S.-K.-
dc.contributor.authorChun J.-H.-
dc.contributor.authorKim K.-M.-
dc.contributor.authorYook J.-M.-
dc.contributor.authorKwon, Young Se-
dc.date.accessioned2013-03-27T00:37:56Z-
dc.date.available2013-03-27T00:37:56Z-
dc.date.created2012-02-06-
dc.date.issued2007-10-09-
dc.identifier.citation37th European Microwave Conference, EUMC, v., no., pp.1357 - 1360-
dc.identifier.urihttp://hdl.handle.net/10203/157562-
dc.languageENG-
dc.titleAn X-band high power amplifier module package using selectively anodized aluminum substrate-
dc.typeConference-
dc.identifier.scopusid2-s2.0-48349096076-
dc.type.rimsCONF-
dc.citation.beginningpage1357-
dc.citation.endingpage1360-
dc.citation.publicationname37th European Microwave Conference, EUMC-
dc.identifier.conferencecountryGermany-
dc.identifier.conferencecountryGermany-
dc.contributor.localauthorKwon, Young Se-
dc.contributor.nonIdAuthorYeo S.-K.-
dc.contributor.nonIdAuthorChun J.-H.-
dc.contributor.nonIdAuthorKim K.-M.-
dc.contributor.nonIdAuthorYook J.-M.-
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EE-Conference Papers(학술회의논문)
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