DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, S | - |
dc.contributor.author | Jang, JM | - |
dc.contributor.author | Lee, WS | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-26T23:40:18Z | - |
dc.date.available | 2013-03-26T23:40:18Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-05-26 | - |
dc.identifier.citation | 2009 59th Electronic Components and Technology Conference, ECTC 2009, v., no., pp.771 - 776 | - |
dc.identifier.uri | http://hdl.handle.net/10203/157199 | - |
dc.language | ENG | - |
dc.title | Reliability enhancement of embedded capacitors in printed circuit boards using b-stage epoxy/batio3 composite embedded capacitor films (ECFS) | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-70349695868 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 771 | - |
dc.citation.endingpage | 776 | - |
dc.citation.publicationname | 2009 59th Electronic Components and Technology Conference, ECTC 2009 | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Lee, S | - |
dc.contributor.nonIdAuthor | Jang, JM | - |
dc.contributor.nonIdAuthor | Lee, WS | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.