DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, WK | - |
dc.contributor.author | Yu, D | - |
dc.contributor.author | Lee, C | - |
dc.contributor.author | Yan, L | - |
dc.contributor.author | Yu, A | - |
dc.contributor.author | Yoon, SW | - |
dc.contributor.author | Lau, JH | - |
dc.contributor.author | Cho, MG | - |
dc.contributor.author | Jo, YH | - |
dc.contributor.author | Lee, Hyuck Mo | - |
dc.date.accessioned | 2013-03-26T23:23:39Z | - |
dc.date.available | 2013-03-26T23:23:39Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05-27 | - |
dc.identifier.citation | 2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.1294 - 1299 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/157101 | - |
dc.language | ENG | - |
dc.title | Development of low temperature bonding using in-based solders | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51349084691 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1294 | - |
dc.citation.endingpage | 1299 | - |
dc.citation.publicationname | 2008 58th Electronic Components and Technology Conference, ECTC | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Lee, Hyuck Mo | - |
dc.contributor.nonIdAuthor | Choi, WK | - |
dc.contributor.nonIdAuthor | Yu, D | - |
dc.contributor.nonIdAuthor | Lee, C | - |
dc.contributor.nonIdAuthor | Yan, L | - |
dc.contributor.nonIdAuthor | Yu, A | - |
dc.contributor.nonIdAuthor | Yoon, SW | - |
dc.contributor.nonIdAuthor | Lau, JH | - |
dc.contributor.nonIdAuthor | Cho, MG | - |
dc.contributor.nonIdAuthor | Jo, YH | - |
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