DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, JW | - |
dc.contributor.author | Song, MS | - |
dc.contributor.author | Park, YS | - |
dc.contributor.author | Kwon, YM | - |
dc.contributor.author | Moon, JT | - |
dc.contributor.author | Cho, JS | - |
dc.contributor.author | Yoo, KA | - |
dc.contributor.author | Byun, KY | - |
dc.contributor.author | Joh, CH | - |
dc.contributor.author | Do, EH | - |
dc.contributor.author | Paik, Kyung-Wook | - |
dc.date.accessioned | 2013-03-26T01:30:22Z | - |
dc.date.available | 2013-03-26T01:30:22Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2009-12-09 | - |
dc.identifier.citation | 2009 11th Electronic Packaging Technology Conference, EPTC 2009, v., no., pp.942 - 946 | - |
dc.identifier.uri | http://hdl.handle.net/10203/156782 | - |
dc.language | ENG | - |
dc.title | Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-77950942426 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 942 | - |
dc.citation.endingpage | 946 | - |
dc.citation.publicationname | 2009 11th Electronic Packaging Technology Conference, EPTC 2009 | - |
dc.identifier.conferencecountry | Singapore | - |
dc.identifier.conferencecountry | Singapore | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Shin, JW | - |
dc.contributor.nonIdAuthor | Song, MS | - |
dc.contributor.nonIdAuthor | Park, YS | - |
dc.contributor.nonIdAuthor | Kwon, YM | - |
dc.contributor.nonIdAuthor | Moon, JT | - |
dc.contributor.nonIdAuthor | Cho, JS | - |
dc.contributor.nonIdAuthor | Yoo, KA | - |
dc.contributor.nonIdAuthor | Byun, KY | - |
dc.contributor.nonIdAuthor | Joh, CH | - |
dc.contributor.nonIdAuthor | Do, EH | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.