Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chung, CK | ko |
| dc.contributor.author | Kwon, YM | ko |
| dc.contributor.author | Kim, I | ko |
| dc.contributor.author | Son, HY | ko |
| dc.contributor.author | Choo, KS | ko |
| dc.contributor.author | Kim, SJ | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2013-03-26T00:16:40Z | - |
| dc.date.available | 2013-03-26T00:16:40Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2007-11-19 | - |
| dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/156312 | - |
| dc.language | English | - |
| dc.publisher | 123 | - |
| dc.title | Theoretical prediction and experimental measurement of the degree-of-cure of Anisotropic Conductive Film (ACF) for Chip-On-Flex (COF) applications | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000259300000040 | - |
| dc.identifier.scopusid | 2-s2.0-51249101941 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Daejeon | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
| dc.contributor.nonIdAuthor | Kwon, YM | - |
| dc.contributor.nonIdAuthor | Kim, I | - |
| dc.contributor.nonIdAuthor | Son, HY | - |
| dc.contributor.nonIdAuthor | Choo, KS | - |
| dc.contributor.nonIdAuthor | Kim, SJ | - |
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