DC Field | Value | Language |
---|---|---|
dc.contributor.author | Shin, H | - |
dc.contributor.author | Song, J | - |
dc.contributor.author | Yu, Jin | - |
dc.date.accessioned | 2013-03-26T00:15:50Z | - |
dc.date.available | 2013-03-26T00:15:50Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2007-11-19 | - |
dc.identifier.citation | International Conference on Electronic Materials and Packaging 2007, EMAP 2007, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/156310 | - |
dc.language | ENG | - |
dc.title | Thermal behavior of Sn nanowires for nano-interconnection | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-51249113665 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | International Conference on Electronic Materials and Packaging 2007, EMAP 2007 | - |
dc.identifier.conferencecountry | South Korea | - |
dc.identifier.conferencecountry | South Korea | - |
dc.contributor.localauthor | Yu, Jin | - |
dc.contributor.nonIdAuthor | Shin, H | - |
dc.contributor.nonIdAuthor | Song, J | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.